Dimension of target substrate (W*D) |
30*50 to 200*300 [mm] (layout option available) |
Target substrate thickness |
1.0 to 3.2 [mm] (Necessary backup pins on board) |
Mounting Tact |
About 3.5 seconds between tip stick and substrate |
Repeat stop accuracy |
Automatic image processing: ± 0.04 [mm] (0402 and 0603 is another option)
Stage Alignment: ± 0.05 [mm] (20□QFP) |
Mounting angle |
0 °, 90 °, 180 °, 270 ° (resolution 0.036 (degree / pulse)) |
Manual operation resolution |
X ? Y ? Z 2 [μm / pulse] |
5 axis control |
Precision ball screw |
Mountable parts |
0201 ? 0402 ? 0603 ? 1005 ~ QFP ? BGA ? CSP / connector / solder ball |
Mountable part height |
10 mm or less |
Target component packaging |
8 mm wide, scrap tape, rose state, palette |
Substrate positioning method |
Left hand external reference reference, slide bar variable |
Number of chip sticks that can be installed simultaneously |
20 types (in case of 8 mm width tape conversion / work size 250 × 330) |
Power supply / power consumption |
AC 100 V ± 10% / 50/60 Hz / 1.2 KVA |
Air pressure |
0.4 MPa to 0.6 Mpa ? dry air |
Head X ? Y stroke range |
A range of 335 × 420 [mm] |
Drive system |
Pulse motor |
controller |
Back built-in |
computer |
Built-in personal computer / 17 inch color monitor |
Work holder |
Front reference single end sliding type |
Alignment Stage |
Motor slide method |
Tool change |
Bit 5 auto exchange (All bits are optional) |
Body dimensions |
Width 700 × depth 740 × height 600 [mm] |