• Compact Mounter SMT-64RH Exterior
  • For R&D, Prototyping, and High-Mix Low-Volume Production
  • Compatible with Various Feeding Methods
  • Thermo-Compression Bonding Mounting
  • Customizable Layout
  • Flipping Loose Parts with Front/Back Identification
コンパクトマウンターSMT-64RHイメージ画像

Compact Mounter SMT-64RH for Prototyping and Low-Volume Production

  • Supports a wide range of components, from 0201 chips to CSPs.
  • A displacement sensor enables mounting according to component height. It also detects PCB warpage during mounting to achieve higher placement accuracy.
  • Press-fit depth can be adjusted during mounting using force control.
Spec
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Watch SMT-64RH in Operation

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Spec

Applicable PCB Size (W × D) 30 × 50 to 200 × 330 [mm] (Layout options available)
Applicable PCB Thickness 1.0 to 3.2 [mm] (Backup pins required depending on the PCB)
For PCBs thinner than 1.0 mm, a backup base (optional) can be used.
Mounting Tact Time Approximately 3.5 seconds from chip pickup to board placement
Repeat Positioning Accuracy Automatic Image Processing: ±0.04 [mm]
Stage Alignment: ±0.05 [mm] (20 mm square QFP)
Mounting Angle 0°, 90°, 180°, 270° (Resolution: 0.036 [degrees/pulse])
Manual Operation Resolution X, Y, Z: 2 [μm/pulse]
5-Axis Control Precision Ball Screws
Mountable Components 0201, 0402, 0603, 1005 to QFP, BGA, CSP / Connectors / Solder Balls
Maximum Component Height 10 mm or less
Applicable Component Packaging 8 mm tape, cut tape, loose parts, pallets
PCB Positioning Method Front-left edge reference, adjustable slide bar
Maximum Number of Simultaneously Loaded Chip Stick Types 20 types (Equivalent to 8 mm tape / With a workpiece size of 200 × 330 mm)
Power Supply / Power Consumption AC100V ±10% / 50/60 Hz / 1.2 KVA
Air Pressure 0.4 MPa to 0.6 MPa, dry air
Drive System Pulse Motor
Controller Built into the Rear of the Main Unit
Computer PC with Dedicated Board / 17-inch Color Monitor
Work Holder Front Reference, One-Side Slide Type
Alignment Stage Motorized Slide Type
Tool Change Automatic Exchange of 5 Bits (All bits are optional)
Main Unit Dimensions 700 (W) × 830 (D) × 660 (H) [mm]
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Options

Automatic Image Processing Tray Component Supply Base Vacuum Work Base
Mounting Force Control Solder Ball Mounting Thermo-Compression Bonding Unit
Displacement Sensor Loose Parts Supply Specification Various Pickup Bits (Nozzles / Collets)
High-Magnification Camera for Fine Components Tape Feeder Various Control Software
Image Capture & Storage Simple Transfer Base Area Sensor
Auto Dispensing Function Signal Tower
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