MounterMR-250L Simple chip mounting machine

Mounter

Features

  • L size substrate compatible
  • Cut tape standard compliant
  • Ideal for organic EL development

Ultra-compact, low price, easy operation, highly popular MR-250 series comes with long-awaited L size board version available! !

For small quantities of various kinds and organic EL

Applicable substrate size Maximum 510 mm × 460 mm, 8 mm width cut tape maximum 40 feedable. Feeder correspondence is also acceptable. It is also possible to apply coating heating on small production quantities of various kinds of production sites and large format film substrates.

Spec

model MR-250 MR-250M (M size compatible) MR-250L (L size compatible)
body size Width 460 X depth 700 X height (550) [mm] (desktop standard) Width 690 X depth 780 X height (550) [mm] (desktop standard) Width 960 X depth 1150 X height 1400 [mm] (independent type only)
weight About 40 [kg] About 55 [kg] About 550 [kg]
Mounting precision ± 0.10 [mm]
Work size Maximum 150 X 150 [mm] Maximum 250 X 330 [mm] Maximum 510 X 460 [mm]
Work thickness 1.0 to 2.4 [mm]
Supply of parts
  • Chip stick (8 mm X 10)
  • Tape feeder* (8 mm X max 5)
  • Tray* (4 inches X 1 sheet)
  • Chip stick (8 mm X 20)
  • Tape feeder* (8 mm X max 10)
  • Tray* (4 inches X 2 sheet)
  • Chip stick (8 mm X 40)
  • Tape feeder* (8 mm X max 16)
  • Tray* (4 inches X 4 sheet)
Alignment method Exclusive collet*, automatic image processing*, stage alignment*
Other
  • Mounter function
  • Dispense function
  • Auto tool change function
  • Personal computer control
  • Independent type*
  • safety cover*
  • Mounter function
  • Dispense function
  • Auto tool change function
  • Personal computer control
  • Independent type
  • safety cover
Power supply / air AC 100 V, 50/60 Hz, 0.4 to 0.6 MPa
List price 2,800,000 yen ~ 3,800,000 yen ~ 6,500,000 yen ~
Main Options Automatic image processing, Load cell, Conveyor specification (Inlining), Standard / Simple stage, Standard transfer unit / Simple transfer base, Rough supply specification, Tape feeder, Part feeder support, Solder ball mounted specification, Dispensing controller, Point reflow, Heat Crimp unit, loader / unloader, signal tower, area sensor
* Option Specification
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