| Dimension of target substrate (W*D) |
30*50 to 200*150 [mm] (layout option available) |
| Target substrate thickness |
1.0 to 3.2 [mm] (Necessary backup pins on board) |
| Mounting Tact |
About 2.5 seconds between tip stick and substrate |
| Dispense Tact |
Approximately 1 second (varies depending on the coating time) |
| Heating Tact |
About 6 seconds (varies depending on target board) |
| Repeat stop accuracy |
± 0.05 mm |
| Mounting angle |
360 ° free setting (resolution 0.036 degree / pulse) |
| Manual operation resolution |
X ? Y ? Z 2 μm / pulse |
| 5 axis control |
Precision ball screw |
| Mountable parts |
1005 or more chip parts, LED, electrode parts etc. |
| Mountable part height |
8 mm or less |
| Target component packaging |
8 mm wide, scrap tape |
| Substrate positioning method |
Left hand external reference reference, slide bar variable |
| Number of chip sticks that can be installed simultaneously |
20 types (in case of 8 mm width tape conversion) |
| Power supply / power consumption |
AC 100 V ± 10% / 50/60 Hz / 1.2 KVA |
| Air pressure |
0.4 MPa to 0.6 MPa ? dry air |
| Head X ? Y stroke range |
A range of 335 × 420 [mm] |
| Drive system |
Pulse motor |
| controller |
Back built-in |
| computer |
Built-in personal computer / 17 inch color monitor |
| Work holder |
Front reference single end sliding type |
| Alignment Stage |
Motor slide method (option) |
| Tool change |
Bit 5 auto exchange (All bits are optional) |
| Body dimensions |
Width 700 × depth 740 × height 600 [mm] |