• Simple Die Bonder ZD-5 - Main Unit
  • Rapid Heating Pulse Heater Nozzle
  • Standard Equipped with Displacement and Pressure Detection Sensors
  • Simple Flip Chip Mechanism
  • Simple Transfer Base
  • Bottom Heater
Simple Die Bonder ZD-5 - Main Unit

Simple Die Bonder ZD-5 Standard Equipped with Displacement and Pressure Detection Sensors

  • Stroke control is available during mounting and dispensing.
  • Component pickup and mounting at a specified pressure are available.
  • Loose component mounting is available through automatic image processing. A flipping operation is available using the simple flip chip mechanism.
Spec
Contact Us for a Demonstration

Watch ZD-5 in Operation

Spec

Model Simple Die Bonder ZD-5
Basic Function Die Bonding
Bonding Method Thermocompression Bonding
Mounting Accuracy ±30μm
Applicable Substrate Size 100 × 70 to 100 × 120 [mm]
Applicable Substrate Thickness 1.0 to 2.4 [mm]
Applicable Component Size □0.3 to 10 [mm]
Component Supply 2-inch tray, loose component supply tray, stage supply
Head Configuration Pulse heater nozzle, motor-driven dispensing unit,
automatic nozzle changer, displacement sensor, pressure detection sensor
Control Software Dedicated software, interactive operation, log data can be saved in CSV format
Power Supply AC100 [V] 50–60 [Hz]
Air Supply Factory air: 0.4–0.6 [MPa]
Dimensions 500 [W] × 850 [D] × (1320) [H]
Weight Approx. 190 [kg]
Safety Features Emergency stop switch, safety cover with interlock, signal tower*, area sensor*
Main Options Ionizer, transfer nozzle, bottom heater,
2-zone transfer base 0.1/0.05 [mm] (depth configurable)
*Optional specifications
Contact Us for a Demonstration
  • Compact Mounter SMT-64RH
    SMT-64RH
    Compact Mounter
    Mounting Accuracy: ±40um
  • Go to the MRS-850 page for dispensing, mounting, and heating
    MRS-850
    Multi Robo Station
    Mounting Accuracy: ±60um
Top of Page.