DipcoVer, DCK type, Circuit board warpage caused by factors such as heat, Solder fogging prevention inside the DIP tank, Circuit board jig
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Features
- Controls circuit board warpage caused by factors such as heat and prevents solder fogging.
- Effective even when there are perforations for division.
- Can be used even when the insertion depth (B) to the circuit board is shallow.
- Controls circuit board strain in air reflow.
- Prevents mounter operation hindrances from harm such as circuit board warpage and deflection.
- Compatible with Rohs.
| Carrier hold | Prevention of circuit board warpage | Prevention of solder fogging | Flow tank | Reflow oven | Cutter |
|---|---|---|---|---|---|
| unacceptable | excellent | excellent | excellent Possible to use |
relatively poor Can be used |
good Possible to use |
Product Specifications
| Corresponding circuit board thickness (t) | Thickness: 1.6mm Can be used at a ± 0.1 dipping depth ≤ t |
|---|---|
| Heatresistance | 260ﾟC within 2 minutes/ (without pressurization) max |
| Number of Uses | Over 200 times (used repeatedly at 245ﾟC soldering at a 4 second interval) |
| Rohs | Compatible |
Standard Size List
| Model Number | Length(A) | Insertion Depth (B) | Corresponding circuit board thickness (t) | Shape |
|---|---|---|---|---|
| DCK-0554.5 | 55mm | 4.5mm | 1.6mm |  |
| DCK-1004.5 | 100mm | |||
| DCK-1204.5 | 120mm | |||
| DCK-1554.5 | 155mm | |||
| DCK-1704.5 | 170mm | |||
| DCK-2004.5 | 200mm | |||
| DCK-2204.5 | 220mm | |||
| DCK-2404.5 | 240mm | |||
| DCK-2604.5 | 260mm | |||
| DCK-2804.5 | 280mm | |||
| DCK-3004.5 | 300mm | |||
| DCK-3204.5 | 320mm |
Precautions when using
- Solder may adhere depending on the usage.
- Immediately remove after soldering.
- Make judgment on the lifespan based on the dimensions and deformation of the opening parts and the amount of exfoliation in the coating.
