Contactless Point Reflow APR-20A

ORDER: Distributors

Contactless Point Reflow APR-10A Easy reflow of finite parts with non-contact heating! Semi-automatic soldering, Quality and stability, Advanced skills not required, Compact

Features

Reflow Function

This function enables soldering at the minimum heated air flow without blowing off minute parts such as the 0402 chip. This is optimal for soldering in the narrow pitch mounting.
Reflow
Rework

Rework Function

With this function minute parts with a 1005 size chip or less can be removed with ease. This is optimal for narrow pitch mounting repair.

Easy Position Determination

The heating center is guided by light. The center of the minute parts is accurately determined.
* Accuracy depends on part size.

The heating center is guided by light.
Assistant Heater Photo

Assistant Heater

Multi-layered circuit boards and ceramic circuit boards which have difficulty in raising their temperature can be supported through using an assistant heater from the bottom.


Complete control of heating range

It is possible to change the heating range from 0402〜QFP to multipoint heating with various optional nozzles. Moreover, replacement of the nozzle is very easy with screw type.
Various optional nozzles
Various optional nozzles
Batch heating nozzle
Batch heating nozzle

Watch the APR-20A operation video (WMV file / JP)


Product Specifications

APR-20A Main body specifications

Correspondence to M size board, automatic point reflow (MH-250) is also possible.
Model APR-20A
Main body size (length x width x height) 345 x 365 x 380mm
Weight Around 20kg
Target circuit board size 40 x 40-200 x 170mm
Heating method Hot air method (250W)
Maximum heating temperature 450℃
Standard attachments 1 nozzle (supporting 0402 chip - 1005 chip) / 1 CA sensor
Cycle time
(depending on the built-in circuit board)
Heating: 4-10sec/chip
Operation switch Mode change, Select, UP, DOWN, Enter/Start/Stop
Power source/Air AC100V, 0.4〜0.6MPa
Heating gas Atmosphere / N2

Options

Work stage PWS-20(XY stage part)
Assistant Heater 100V / 100W (temperature setting max is 150℃)
Heating nozzle For 1608-2125 chip usage / For 3mm opening usage / 2-hole type

PWS-20 (XY stage part)

Target circuit board size Opening 40-200 x 170mm / t=1.6
(Sizes other than the standard specifications are optional)
Circuit board securing method Magnetic moveable circuit board supporter / Height 25mm x 4 supporters
XY moveable parts Knob operation / Movable stroke (X,Y) = (±30, ±50)mm
Stage part size (length x width x height) 250 x 250 x 55o
Stage part Weight Around 2kg