Dimension of target substrate (W*D) |
30*50 to 200*150 [mm] (layout option available) |
Target substrate thickness |
1.0 to 3.2 [mm] (Necessary backup pins on board) |
Mounting Tact |
About 2.5 seconds between tip stick and substrate |
Dispense Tact |
Approximately 1 second (varies depending on the coating time) |
Heating Tact |
About 6 seconds (varies depending on target board) |
Repeat stop accuracy |
± 0.05 mm |
Mounting angle |
360 ° free setting (resolution 0.036 degree / pulse) |
Manual operation resolution |
X ? Y ? Z 2 μm / pulse |
5 axis control |
Precision ball screw |
Mountable parts |
1005 or more chip parts, LED, electrode parts etc. |
Mountable part height |
8 mm or less |
Target component packaging |
8 mm wide, scrap tape |
Substrate positioning method |
Left hand external reference reference, slide bar variable |
Number of chip sticks that can be installed simultaneously |
20 types (in case of 8 mm width tape conversion) |
Power supply / power consumption |
AC 100 V ± 10% / 50/60 Hz / 1.2 KVA |
Air pressure |
0.4 MPa to 0.6 MPa ? dry air |
Head X ? Y stroke range |
A range of 335 × 420 [mm] |
Drive system |
Pulse motor |
controller |
Back built-in |
computer |
Built-in personal computer / 17 inch color monitor |
Work holder |
Front reference single end sliding type |
Alignment Stage |
Motor slide method (option) |
Tool change |
Bit 5 auto exchange (All bits are optional) |
Body dimensions |
Width 700 × depth 740 × height 600 [mm] |