DipcoVer, DCHF type, Circuit board warpage caused by factors such as heat, Solder fogging prevention inside the DIP tank, Circuit board jig
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Features
- Controls circuit board warpage caused by factors such as heat and prevents solder fogging.
- This covers the pilot hole of the post attachment part near the edge surface of the circuit board. This is especially effective when the jet stream level gets higher and the size of the circuit board is 200mm or more.
- Compatible with Rohs.
| Carrier hold | Prevention of circuit board warpage | Prevention of solder fogging | Flow tank | Reflow oven | Cutter |
|---|---|---|---|---|---|
| excellent | relatively poor | relatively poor | excellent Possible to use |
relatively poor Can be used |
good Possible to use |
Product Specifications
| Corresponding circuit board thickness (t) | Thickness: 1.6mm Can be used at a ± 0.1 dipping depth ≤ t |
|---|---|
| Heatresistance | 260ﾟC within 2 minutes/ (without pressurization) max |
| Number of Uses | Over 200 times (used repeatedly at 245ﾟC soldering at a 4 second interval) |
| Rohs | Compatible |
Standard Size List
| Model Number | Length(A) | Insertion Depth (B) | Corresponding circuit board thickness (t) | Shape |
|---|---|---|---|---|
| DCHF-05507 | 55mm | 7.0mm | 1.6mm |  |
| DCHF-10007 | 100mm | |||
| DCHF-12007 | 120mm | |||
| DCHF-15507 | 155mm | |||
| DCHF-17007 | 170mm | |||
| DCHF-20007 | 200mm | |||
| DCHF-22007 | 220mm | |||
| DCHF-24007 | 240mm | |||
| DCHF-26007 | 260mm | |||
| DCHF-28007 | 280mm | |||
| DCHF-30007 | 300mm | |||
| DCHF-32007 | 320mm |
Precautions when using
- Solder may adhere depending on the usage.
- Immediately remove after soldering.
- Make judgment on the lifespan based on the dimensions and deformation of the opening parts and the amount of exfoliation in the coating.
